But now the Japanese technology company NEC, have a solution to solve the problem by creating a water colling in smartphone technology. NEC presents a smartphone named Medias X 06E of the article will be supplied water colling technology.
NEC Medias X 06E planned to be supplied an colling pipe located on the back of the screen, which will directly connecting the processors from smartphone. This technology is expected to send heat generated by the processor through repeated evaporation and condensation.
The use of water colling technology on smartphones run Quad core Snapdragon processor 1.7 GHz, it looks a bit excessive. However, the NEC's own claim that the future of this technology will be a regular feature of a smartphone.
Medias X 06E also reportedly be equipped OLED screen measuring 4.7 inches, and a camera with a resolution of 13.1 MP that is big enough. Based on information circulating this smartphone will premiere in Japanese gliding in cellular operator NTT DoCoMo, June 2013.
